US Patent 11450756 Manufacturing method of semiconductor chip
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Patent Applicant
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Patent Number
114507560
Date of Patent
September 20, 2022
0Patent Application Number
170017840
Date Filed
August 25, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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Golden AI
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
114507560
Date of Patent
September 20, 2022
0Patent Application Number
170017840
Date Filed
August 25, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
Edits on 27 Sep, 2022
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US Patent 11450756 Manufacturing method of semiconductor chip
Article
A semiconductor chip includes a substrate and a transistor. The transistor is formed on the substrate and includes an insulation layer and a fin. The fin includes a base portion and a protrusion connected with the base portion, wherein the protrusion is projected with respect to an upper surface of the base portion and has a recess recessed with respect to the upper surface.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
114507560
Date of Patent
September 20, 2022
0Patent Application Number
170017840
Date Filed
August 25, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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