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US Patent 11462419 Microelectronic assemblies
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Patent
0
Date Filed
July 3, 2019
0
Date of Patent
October 4, 2022
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Patent Application Number
16503021
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Patent Citations
US Patent 10032722 Semiconductor package structure having am antenna pattern and manufacturing method thereof
US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
US Patent 10269756 Die processing
0
US Patent 10269853 Image sensor device
US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
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US Patent 10418277 Air gap spacer formation for nano-scale semiconductor devices
US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
US Patent 10707087 Processing stacked substrates
•••
Patent Citations Received
US Patent 12125784 Interconnect structures
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US Patent 11621246 Diffused bitline replacement in stacked wafer memory
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US Patent 11631647 Integrated device packages with integrated device die and dummy element
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US Patent 11694925 Diffusion barrier collar for interconnects
0
US Patent 11756880 Interconnect structures
US Patent 11764177 Bonded structure with interconnect structure
US Patent 11790219 Three dimensional circuit implementing machine trained network
US Patent 11862602 Scalable architecture for reduced cycles across SOC
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US Patent 11862604 Systems and methods for releveled bump planes for chiplets
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US Patent 11876076 Apparatus for non-volatile random access memory stacks
0
•••
Patent Inventor Names
Belgacem Haba
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
11462419
0
Patent Primary Examiner
Cuong B Nguyen
0
CPC Code
H01L 23/3107
0
H01L 21/76877
0
H01L 21/82
0
H01L 23/528
0
H01L 2224/02379
0
H01L 2224/18
0
H01L 24/97
0
H01L 24/19
0
H01L 24/20
0
H01L 21/565
0
•••
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