US Patent 11462430 Ceramic-circuit composite structure and method for making the same

The present invention provides a ceramic-circuit composite structure, comprising: a ceramic plate with a supporting surface that has a recessed supporting portion; a curved-surface circuit buried in the ceramic plate; and a power supply module electrically connected to the curved-surface circuit. Moreover, the present invention provides a method for making the ceramic-circuit composite structure. The ceramic-circuit composite structure of the present invention makes use of the curved-surface circuit to improve the prior art problem that a planar circuit has less static electricity or lower temperature at the center than in the peripheral region.