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US Patent 11868056 Substrate processing apparatus

Patent 11868056 was granted and assigned to Tokyo Electron on January, 2024 by the United States Patent and Trademark Office.

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Patent Applicant

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Kouichi Mizunaga0

Toshichika Takei0

Date of Patent

January 9, 2024

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Patent Application Number

180465670

Date Filed

October 14, 2022

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Patent Citations

US Patent 8519309 Wafer heating apparatus and semiconductor manufacturing apparatus

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US Patent 8748780 Substrate processing apparatus, substrate processing method, and computer-readable storage medium

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US Patent 11450552 Methods and apparatus for adjusting surface topography of a substrate support apparatus

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US Patent 11462430 Ceramic-circuit composite structure and method for making the same

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Patent Citations Received

US Patent 12094694 Substrate processing apparatus and substrate processing method

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Patent Primary Examiner

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CPC Code

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Patent abstract

A heat treatment unit U

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