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US Patent 11462483 Wire bond wires for interference shielding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 16, 2019
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Date of Patent
October 4, 2022
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Patent Application Number
16715524
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Patent Citations
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US Patent 10115671 Incorporation of passives and fine pitch through via for package on package
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US Patent 10115678 Wire bond wires for interference shielding
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US Patent 10181457 Microelectronic package for wafer-level chip scale packaging with fan-out
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US Patent 10559537 Wire bond wires for interference shielding
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US Patent 10079225 Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
Patent Inventor Names
Zhuowen Sun
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Ashok S. Prabhu
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Wael Zohni
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Willmar Subido
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Abiola Awujoola
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11462483
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Patent Primary Examiner
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Jasmine J Clark
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CPC Code
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H01L 2224/73204
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H01L 2224/73207
0
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H01L 2224/13076
0
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H01L 2224/13082
0
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H01L 2224/1134
0
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H01L 2224/13025
0
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H01L 2224/48227
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H01L 24/06
0
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H01L 2224/215
0
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H01L 24/16
0
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