Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Dino Sasaridis0
Colin Kenneth Campbell0
Alan David Tepe0
Robert James Ramm0
Wenjun Liu0
Date of Patent
October 18, 2022
0Patent Application Number
153340900
Date Filed
October 25, 2016
0Patent Primary Examiner
A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
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