US Patent 11476213 Bonded structures without intervening adhesive

Patent

US Patent 10075657 Edgeless large area camera system

US Patent 10204893 Stacked dies and methods for forming bonded structures

US Patent 10269756 Die processing

US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer

US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein

US Patent 10410976 Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device

US Patent 10418277 Air gap spacer formation for nano-scale semiconductor devices

US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture

US Patent 10707087 Processing stacked substrates

US Patent 10727219 Techniques for processing devices

US Patent 12125784 Interconnect structures

US Patent 11894345 Integrated voltage regulator and passive components

US Patent 11916054 Stacked devices and methods of fabrication

US Patent 11929347 Mixed exposure for large die

US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics

US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

US Patent 11978724 Diffused bitline replacement in memory

US Patent 12068278 Processed stacked dies

US Patent 12074092 Hard IP blocks with physically bidirectional passageways

US Patent 12113056 Stacked dies and methods for forming bonded structures

United States Patent and Trademark Office

Didarul A Mazumder

H01L 25/0657

H01L 21/6836

H01L 24/92

H01L 21/6835

H01L 23/3135

H01L 24/80

H01L 2224/80895

H01L 2224/80896

H01L 24/73

H01L 24/94