Patent attributes
A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.
