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US Patent 11480394 Heat pipes having wick structures with variable permeability
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Patent
Date Filed
July 16, 2019
Date of Patent
October 25, 2022
Patent Application Number
17260390
Patent Citations Received
US Patent 11784108 Thermal management in integrated circuit packages
US Patent 12007170 Thermal management in integrated circuit packages
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11480394
Patent Primary Examiner
Tho V Duong
CPC Code
H05K 7/2029
F28D 15/04
F28D 15/046
H01L 23/427
H05K 7/20336
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