US Patent 11480745 Companion and host chip photonic integration
Patent 11480745 was granted and assigned to Ciena Corporation on October, 2022 by the United States Patent and Trademark Office.
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Edits on 16 Oct, 2023
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Patent Inventor Names
Charles Baudot0
Claude Gamache0
François Pelletier0
Simon Savard0
Edits on 28 Oct, 2022
Golden AI
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US Patent 11480745 Companion and host chip photonic integration
Article
At least a portion of an integrated circuit wafer includes at least one layer in which two or more waveguides are formed. A cavity is formed in the integrated circuit wafer. At least one die, comprising a photonic integrated circuit, has: at least one edge on which there are two or more optical mode defining structures in proximity to respective optical mode defining structures on at least one surface of the cavity, a bottom surface secured to a bottom surface of the cavity, and a top surface on which there is at least one metal contact.
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Patent Jurisdiction
Patent Number
114807450
Date of Patent
October 25, 2022
0Patent Application Number
171224910
Date Filed
December 15, 2020
0Patent Primary Examiner
CPC Code
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