Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 1, 2022
Patent Application Number
17129015
Date Filed
December 21, 2020
Patent Citations Received
Patent Primary Examiner
CPC Code
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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