US Patent 11488934 Semiconductor package and manufacturing method thereof
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Patent Number
114889340
Date of Patent
November 1, 2022
0Patent Application Number
171290150
Date Filed
December 21, 2020
0Patent Primary Examiner
CPC Code
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US Patent 11488934 Semiconductor package and manufacturing method thereof
Article
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
Infobox
Is a
Patent Jurisdiction
Patent Number
114889340
Date of Patent
November 1, 2022
0Patent Application Number
171290150
Date Filed
December 21, 2020
0Patent Primary Examiner
CPC Code
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