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US Patent 11509100 High density receptacle

Patent 11509100 was granted and assigned to Molex on November, 2022 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Molex

Current Assignee

Molex

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

115091000

Patent Inventor Names

Teng-Kai Chen0

John C. Laurx0

Li Zhuang0

Date of Patent

November 22, 2022

Patent Application Number

169605460

Date Filed

January 8, 2019

Patent Citations

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US Patent 10439317 Hermetically sealed electrical connector assembly

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US Patent 10505302 Connector

Patent Primary Examiner

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Phuong Chi Thi Nguyen

CPC Code

A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g.,

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