US Patent 11509100 High density receptacle
Patent 11509100 was granted and assigned to Molex on November, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
John C. Laurx0
Li Zhuang0
Teng-Kai Chen0
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US Patent 11509100 High density receptacle
Article
A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g.,
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
115091000
Date of Patent
November 22, 2022
0Patent Application Number
169605460
Date Filed
January 8, 2019
0Patent Citations
Patent Primary Examiner
CPC Code
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