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US Patent 11523543 Water cooled server

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 6, 2022
0
Date of Patent
December 6, 2022
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Patent Application Number
17739048
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Patent Citations
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US Patent 10249503 Printed circuit board, semiconductor package and method of manufacturing the same
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US Patent 10336599 Cover for a water cooler reservoir bottle
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US Patent 10461009 3DIC packaging with hot spot thermal management features
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US Patent 10624236 Liquid immersion tank
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US Patent 10966338 Densely packed electronic systems
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US Patent 10910364 3D semiconductor device
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US Patent 11064626 Densely packed electronic systems
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US Patent 10039210 Integrated thermal inserts and cold plate
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US Patent 10212849 Liquid immersion tank, and apparatus including liquid immersion tank
Patent Citations Received
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US Patent 12136576 Microelectronic module
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Patent Inventor Names
Peter C. Salmon
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11523543
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Patent Primary Examiner
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Courtney L Smith
0

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