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US Patent 11525184 Dual selective deposition

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11525184
Date of Patent
December 13, 2022
Patent Application Number
17331971
Date Filed
May 27, 2021
Patent Citations
‌
US Patent 10047435 Dual selective deposition
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US Patent 10049924 Selective formation of metallic films on metallic surfaces
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US Patent 10115603 Removal of surface passivation
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US Patent 10157786 Selective formation of metallic films on metallic surfaces
‌
US Patent 10186420 Formation of silicon-containing thin films
‌
US Patent 10204782 Combined anneal and selective deposition process
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US Patent 10343186 Vapor phase deposition of organic films
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US Patent 10373820 Deposition of organic films
...
Patent Primary Examiner
‌
Elizabeth A Burkhart
CPC Code
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C23C 16/45525
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C23C 16/18
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C23C 16/402
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C23C 16/06
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C23C 16/04

Methods are provided for dual selective deposition of a first material on a first surface of a substrate and a second material on a second, different surface of the same substrate. The selectively deposited materials may be, for example, metal, metal oxide, or dielectric materials.

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