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US Patent 11527696 Low footprint resonator in flip chip geometry

Overview Structured Data Issues Contributors Activity

Is a

Current Assignee

Date Filed

October 5, 2017

Date of Patent

December 13, 2022

Patent Applicant

Patent Application Number

16753431

Patent Citations

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US Patent 10121754 Interconnect structures and methods for fabricating interconnect structures

US Patent 10586909 Cryogenic electronic packages and assemblies

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US Patent 10242968 Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages

US Patent 10381541 Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

US Patent 10396269 Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

CPC Code

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