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US Patent 11538763 Chip package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 11, 2021
0
Date of Patent
December 27, 2022
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Patent Application Number
17372459
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Patent Citations
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US Patent 10490521 Advanced structure for info wafer warpage reduction
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US Patent 10192796 Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP
0
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US Patent 10043768 Semiconductor device and method of manufacture thereof
Patent Citations Received
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US Patent 12062618 Chip package
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US Patent 11894306 Chip package
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Patent Inventor Names
Ping-Jung Yang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11538763
0
Patent Primary Examiner
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Xiaoming Liu
0

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