Patent attributes
A sensor and a preparation method thereof are provided, the sensor includes a sensor substrate, functional cuts, crack-arrest holes, a patterned electrode, wires, an adhesive layer, and release paper. The preparation method includes following steps, preparing the sensor substrate and sticking the adhesive layer on the sensor substrate; then sticking the release paper on the adhesive layer; obtaining the functional cuts by laser cutting or blanking process; pasting a metal mask on a surface of the sensor substrate; depositing a material of the patterned electrode into a gap of the metal mask; removing the metal mask after a solvent of the liquid is volatilized; leading out the wires from patterned electrode pins; obtaining the sensor eventually. The sensor has advantages such as controllable adhesion, small size, light weight, sensitive sensing and simple manufacturing. The sensors are arrayable and suitable for sticking and sensing of large deformation and complex surfaces.
