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US Patent 11545458 Semiconductor package

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

April 2, 2021

Date of Patent

January 3, 2023

Patent Application Number

17221304

Patent Citations

US Patent 11251157 Die stack structure with hybrid bonding structure and method of fabricating the same and package

US Patent 10026704 Semiconductor package and method of forming the same

US Patent 10026716 3DIC formation with dies bonded to formed RDLs

US Patent 10535632 Semiconductor package structure and method of manufacturing the same

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

Nikolay K Yushin

CPC Code

•••

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