Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 17, 2018
Patent Application Number
15130460
Date Filed
April 15, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method includes forming a dielectric layer over a carrier, forming a plurality of bond pads in the dielectric layer, and performing a planarization to level top surfaces of the dielectric layer and the plurality of bond pads with each other. A device die is bonded to the dielectric layer and portions of the plurality of bond pads through hybrid bonding. The device die is encapsulated in an encapsulating material. The carrier is then demounted from the device die and the dielectric layer.
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