Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 28, 2022
Patent Application Number
16844941
Date Filed
April 9, 2020
Patent Citations
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Patent Citations Received
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Patent Primary Examiner
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element.
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