Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Javier A. DeLaCruz0
Rajesh Katkar0
Shaowu Huang0
Belgacem Haba0
Liang Wang0
Date of Patent
February 16, 2021
0Patent Application Number
162124710
Date Filed
December 6, 2018
0Patent Citations
Patent Citations Received
0
0
0
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Patent Primary Examiner
Patent abstract
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
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