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US Patent 11546991 Densely packed electronic systems
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Patent
Date Filed
March 2, 2022
Date of Patent
January 3, 2023
Patent Application Number
17685322
Patent Citations
US Patent 10336599 Cover for a water cooler reservoir bottle
US Patent 10461009 3DIC packaging with hot spot thermal management features
US Patent 10481650 Electronic device for liquid immersion cooling and cooling system using the same
US Patent 10966338 Densely packed electronic systems
US Patent 11138103 Resiliency groups
US Patent 11064626 Densely packed electronic systems
US Patent 11379254 Dynamic configuration of a cloud-based storage system
US Patent 10039210 Integrated thermal inserts and cold plate
US Patent 10249503 Printed circuit board, semiconductor package and method of manufacturing the same
Patent Citations Received
US Patent 12136576 Microelectronic module
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11546991
Patent Primary Examiner
Courtney L Smith
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