Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 10, 2023
Patent Application Number
17643446
Date Filed
December 9, 2021
Patent Citations Received
0
Patent Primary Examiner
CPC Code
The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D
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