US Patent 11549035 Dielectric substrate and method of forming the same
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Patent Number
115490350
Date of Patent
January 10, 2023
0Patent Application Number
176434460
Date Filed
December 9, 2021
0Patent Primary Examiner
CPC Code
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US Patent 11549035 Dielectric substrate and method of forming the same
Article
The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D
Infobox
Is a
Patent Jurisdiction
Patent Number
115490350
Date of Patent
January 10, 2023
0Patent Application Number
176434460
Date Filed
December 9, 2021
0Patent Primary Examiner
CPC Code
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