Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 21, 2023
Patent Application Number
17060003
Date Filed
September 30, 2020
Patent Citations
Patent Citations Received
Patent Primary Examiner
A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.
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