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US Patent 12112965 Wafer supporting mechanism and method for wafer dicing

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Yan Ting Shen0

Wen-Pin Huang0

Fu Tang Chu0

Bo Hua Chen0

Date of Patent

October 8, 2024

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Patent Application Number

181124660

Date Filed

February 21, 2023

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Patent Citations

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US Patent 8951037 Wafer-level underfill and over-molding

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US Patent 10351956 Integrated two-axis lift-rotation motor center pedestal in multi-wafer carousel ALD

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US Patent 10115646 Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement

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US Patent 11587809 Wafer supporting mechanism and method for wafer dicing

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US Patent 7149070 Holding device, in particular for fixing a semiconductor wafer in a plasma etching device, and method for supplying heat to or dissipating heat from a substrate

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Patent Primary Examiner

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CPC Code

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Patent abstract

A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

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