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US Patent 11600519 Skip-via proximity interconnect

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 16, 2019
Date of Patent
March 7, 2023
Patent Application Number
16572045
Patent Citations
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US Patent 10026687 Metal interconnects for super (skip) via integration
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US Patent 10096515 Interconnect structure for stacked device
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US Patent 10121754 Interconnect structures and methods for fabricating interconnect structures
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US Patent 10181420 Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias
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US Patent 10304818 Method of manufacturing semiconductor devices having conductive plugs with varying widths
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US Patent 10312188 Interconnect structure with method of forming the same
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US Patent 10319629 Skip via for metal interconnects
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US Patent 10340205 Through substrate vias with improved connections
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US Patent 10347528 Interconnect formation process using wire trench etch prior to via etch, and related interconnect
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US Patent 10607922 Controlling via critical dimension during fabrication of a semiconductor wafer
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11600519
Patent Primary Examiner
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Victoria K. Hall
CPC Code
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H01L 23/5226
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H01L 21/76811
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H01L 21/76897
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H01L 23/5283
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H01L 21/76816

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