Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11600590 Semiconductor device and semiconductor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 22, 2019
Date of Patent
March 7, 2023
Patent Application Number
16362347
Patent Citations
‌
US Patent 10622310 Method for fabricating glass substrate package
‌
US Patent 11233176 Semiconductor device and semiconductor device package
‌
US Patent 10163866 Semiconductor device and method of manufacture
‌
US Patent 10181448 Semiconductor devices and semiconductor packages
‌
US Patent 10325853 Method of forming semiconductor packages having through package vias
‌
US Patent 10559547 Semiconductor chip
‌
US Patent 10163745 Package with tilted interface between device die and encapsulating material
‌
US Patent 10163800 Package structure with dummy feature in passivation layer
‌
US Patent 10163813 Chip package structure including redistribution structure and conductive shielding film
‌
US Patent 10008462 Semiconductor package
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11600590
Patent Primary Examiner
‌
Maliheh Malek
CPC Code
‌
H01L 2224/02145
‌
H01L 2224/0215
‌
H01L 2224/02163
‌
H01L 2224/02165
‌
H01L 2224/0217
‌
H01L 2224/03005
‌
H01L 2224/03011
‌
H01L 2224/03015
‌
H01L 2924/014
‌
H01L 2224/13147
•••

Find more entities like US Patent 11600590 Semiconductor device and semiconductor package

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo