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US Patent 11664319 Light engine based on silicon photonics TSV interposer
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Patent
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Date Filed
June 17, 2022
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Date of Patent
May 30, 2023
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Patent Application Number
17843407
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Patent Citations
US Patent 10001611 Optical transceiver by FOWLP and DoP multichip integration
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US Patent 10547156 Submount for semiconductor laser and optical fibers
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US Patent 10566287 Light engine based on silicon photonics TSV interposer
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US Patent 10826613 Integrated compact in-package light engine
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US Patent 10924269 Compact optical module integrated for communicating cryptocurrency transaction
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US Patent 10892830 Integrated compact in-package light engine
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US Patent 11367687 Light engine based on silicon photonics TSV interposer
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US Patent 9595509 Stacked microelectronic package assemblies and methods for the fabrication thereof
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US Patent 9651751 Compact optical transceiver by hybrid multichip integration
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Patent Citations Received
US Patent 12061371 Patch on interposer architecture for low cost optical co-packaging
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11664319
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Patent Primary Examiner
Alonzo Chambliss
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CPC Code
H01L 24/81
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H01L 24/17
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H01L 21/76898
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H01L 25/167
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G02B 6/428
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G02B 2006/12147
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H01L 21/486
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H01L 2924/12042
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H01L 23/5384
0
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