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US Patent 11664333 Method of manufacturing die seal ring

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
United Microelectronics Corporation
United Microelectronics Corporation
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Date Filed
November 24, 2020
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Date of Patent
May 30, 2023
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Patent Applicant
United Microelectronics Corporation
United Microelectronics Corporation
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Patent Application Number
17103584
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Patent Citations
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US Patent 8354734 Semiconductor device with crack prevention ring
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US Patent 9312220 Structure and method for a low-K dielectric with pillar-type air-gaps
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US Patent 9318377 Etch damage and ESL free dual damascene metal interconnect
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US Patent 7285474 Air-gap insulated interconnections
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US Patent 7449407 Air gap for dual damascene applications
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US Patent 7560375 Gas dielectric structure forming methods
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US Patent 7994046 Method for forming a dielectric layer with an air gap, and a structure including the dielectric layer with the air gap
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US Patent 7998861 Method of manufacturing through-via
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US Patent 9425127 Method for forming an air gap around a through-silicon via
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US Patent 9443956 Method for forming air gap structure using carbon-containing spacer
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11664333
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Patent Primary Examiner
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Maliheh Malek
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CPC Code
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H01L 2221/1063
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H01L 2221/1073
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H01L 21/76807
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H01L 21/76808
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H01L 21/7681
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H01L 21/76811
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H01L 21/76813
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H01L 21/7682
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H01L 21/76831
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H01L 21/76834
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•••

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