US Patent 11664333 Method of manufacturing die seal ring
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US Patent 11664333 Method of manufacturing die seal ring
Article
A method of manufacturing a die seal ring including the following steps is provided. A dielectric layer is formed on a substrate. Conductive layers stacked on the substrate are formed in the dielectric layer. Each of the conductive layers includes a first conductive portion and a second conductive portion. The second conductive portion is disposed on the first conductive portion. A width of the first conductive portion is smaller than a width of the second conductive portion. A first air gap is formed between a sidewall of the first conductive portion and the dielectric layer. A second air gap is formed between a sidewall of the second conductive portion and the dielectric layer.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116643330
Date of Patent
May 30, 2023
0Patent Application Number
171035840
Date Filed
November 24, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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