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US Patent 11670615 Bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 22, 2020
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Date of Patent
June 6, 2023
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Patent Application Number
17131588
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Patent Citations
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US Patent 9224704 Process for realizing a connecting structure
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US Patent 10840135 Flat metal features for microelectronics applications
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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US Patent 10854578 Diffused bitline replacement in stacked wafer memory
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US Patent 10879212 Processed stacked dies
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US Patent 10886177 3D chip with shared clock distribution network
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US Patent 10892246 Structures and methods for low temperature bonding using nanoparticles
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US Patent 10923408 Cavity packages
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US Patent 10923413 Hard IP blocks with physically bidirectional passageways
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US Patent 10950547 Stacked IC structure with system level wiring on multiple sides of the IC die
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•••
Patent Citations Received
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US Patent 11948847 Bonded structures
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11670615
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Patent Primary Examiner
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Jasmine J Clark
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CPC Code
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H01L 24/08
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H01L 23/562
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H01L 2224/06165
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H01L 23/10
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H01L 2224/05686
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H01L 2224/05571
0
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H01L 2224/05555
0
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H01L 2224/05552
0
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H01L 2224/05551
0
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H01L 24/80
0
•••

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