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US Patent 11670624 Integrated circuit module with integrated discrete devices
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Patent
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Current Assignee
Advanced Micro Devices
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Date Filed
December 14, 2020
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Date of Patent
June 6, 2023
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Patent Applicant
Advanced Micro Devices
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Patent Application Number
17120753
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Patent Citations
US Patent 10267990 Hybrid interconnect device and method
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US Patent 9735778 Method and apparatuses for optimizing power management on an integrated circuit device
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US Patent 10510721 Molded chip combination
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11670624
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Patent Primary Examiner
Nduka E Ojeh
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