Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 13, 2023
0Patent Application Number
170031130
Date Filed
August 26, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.
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