US Patent 11685650 Microelectromechanical structure with bonded cover
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US Patent 11685650 Microelectromechanical structure with bonded cover
Article
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116856500
Date of Patent
June 27, 2023
0Patent Application Number
169831410
Date Filed
August 3, 2020
0Patent Citations
Patent Primary Examiner
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