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US Patent 11685650 Microelectromechanical structure with bonded cover

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
SiTime
SiTime
0
Date Filed
August 3, 2020
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Date of Patent
June 27, 2023
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Patent Applicant
SiTime
SiTime
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Patent Application Number
16983141
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Patent Citations
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US Patent 7393758 Wafer level packaging process
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US Patent 7098117 Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices
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US Patent 7122395 Method of forming semiconductor devices through epitaxy
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US Patent 7204737 Hermetically sealed microdevice with getter shield
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US Patent 7221033 Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
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US Patent 8871551 Wafer encapsulated microelectromechanical structure and method of manufacturing same
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11685650
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Patent Primary Examiner
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Eugene Lee
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CPC Code
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B81B 2201/0271
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B81B 2203/0315
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B81B 2203/04
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B81B 7/0058
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B81C 1/00269
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B81C 1/00301
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H01L 23/051
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B81B 2207/07
0
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B81B 7/007
0

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