US Patent 11694890 Substrate processing method and substrate processing apparatus
Patent 11694890 was granted and assigned to Tokyo Electron on July, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 25, 2020
0
Date of Patent
July 4, 2023
0
Patent Applicant
Patent Application Number
16829222
0
Patent Citations
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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