Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11694925 Diffusion barrier collar for interconnects

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 6, 2021
0
Date of Patent
July 4, 2023
0
Patent Application Number
17313185
0
Patent Citations
‌
US Patent 11296044 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
0
‌
US Patent 11264357 Mixed exposure for large die
0
‌
US Patent 11276676 Stacked devices and methods of fabrication
0
‌
US Patent 11296053 Direct bonded stack structures for increased reliability and improved yield in microelectronics
0
‌
US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
0
‌
US Patent 11348898 Systems and methods for releveled bump planes for chiplets
0
‌
US Patent 11355404 Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
0
‌
US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
0
‌
US Patent 11367652 Microelectronic assembly from processed substrate
0
‌
US Patent 11373963 Protective elements for bonded structures
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11694925
0
Patent Primary Examiner
‌
Thanh Y. Tran
0
CPC Code
‌
H01L 2224/08237
0
‌
H01L 21/76843
0
‌
H01L 21/68
0
‌
H01L 23/53238
0
‌
H01L 24/09
0
‌
H01L 21/76831
0
‌
H01L 24/06
0
‌
H01L 24/08
0
‌
H01L 24/05
0
‌
H01L 2224/039
0
•••

Find more entities like US Patent 11694925 Diffusion barrier collar for interconnects

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo