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US Patent 11694952 Horizontal pitch translation using embedded bridge dies
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Patent
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Current Assignee
Intel
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Date Filed
February 4, 2022
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Date of Patent
July 4, 2023
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Patent Applicant
Intel
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Patent Application Number
17665315
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Patent Citations
US Patent 9607947 Reliable microstrip routing for electronics components
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US Patent 8866308 High density interconnect device and method
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US Patent 8946900 X-line routing for dense multi-chip-package interconnects
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US Patent 9349703 Method for making high density substrate interconnect using inkjet printing
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US Patent 9420693 Integration of embedded thin film capacitors in package substrates
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US Patent 11276635 Horizontal pitch translation using embedded bridge dies
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11694952
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Patent Primary Examiner
Nicholas J Tobergte
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CPC Code
H01L 23/5381
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H01L 23/538
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