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US Patent 11705355 Substrate transfer system and atmospheric transfer module
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Patent
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Current Assignee
Tokyo Electron
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Date Filed
December 3, 2021
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Date of Patent
July 18, 2023
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Patent Applicant
Tokyo Electron
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Patent Application Number
17542249
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Patent Citations
US Patent 10522381 Aligner apparatus and methods
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US Patent 7527497 Heat treating apparatus, heat treating method, and storage medium
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US Patent 7780438 Substrate heating apparatus and method and coating and developing system
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US Patent 7949425 High throughput wafer notch aligner
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US Patent 11501987 Loadlock module and semiconductor manufacturing apparatus including the same
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11705355
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Patent Primary Examiner
Gerald McClain
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CPC Code
H01L 21/681
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H01L 21/68
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H01L 21/67766
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B65G 47/90
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H01L 21/68707
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H01L 21/67017
0
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