Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Lin Wang
Ya-Jui Tsou
Shao-Yu Lin
Zong-You Luo
Liang-Chor Chung
Chee-Wee Liu
Date of Patent
September 5, 2023
Patent Application Number
17871983
Date Filed
July 25, 2022
Patent Citations
...
Patent Citations Received
0
Patent Primary Examiner
CPC Code
A method includes forming bottom conductive lines over a wafer. A first magnetic tunnel junction (MTJ) stack is formed over the bottom conductive lines. Middle conductive lines are formed over the first MTJ stack. A second MTJ stack is formed over the middle conductive lines. Top conductive lines are formed over the second MTJ stack.
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