US Patent 11749561 Self-alignment etching of interconnect layers
Patent 11749561 was granted and assigned to Applied Materials on September, 2023 by the United States Patent and Trademark Office.
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US Patent 11749561 Self-alignment etching of interconnect layers
Article
A method for etching a metal containing feature is provided. Using a pattern mask, layers of material are etched to expose a portion of a metal containing feature. At least a portion of the exposed metal containing feature is etched, and is replaced by the growth of a filler dielectric. The etched portion of the metal containing feature and the filler dielectric reduce the unwanted conductivity between adjacent metal containing features.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
11749561
Patent Inventor Names
Suketu Arun Parikh
Date of Patent
September 5, 2023
Patent Application Number
17344528
Date Filed
June 10, 2021
Patent Citations
Patent Primary Examiner
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