US Patent 11749629 High-speed die connections using a conductive insert
Patent 11749629 was granted and assigned to Advanced Micro Devices on September, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 10, 2020
Date of Patent
September 5, 2023
Patent Applicant
Patent Application Number
17118126
Patent Inventor Names
Rahul Agarwal
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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