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US Patent 11750191 Three-dimensional logic circuit
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Patent
Date Filed
January 17, 2022
Date of Patent
September 5, 2023
Patent Application Number
17577342
Patent Citations
US Patent 8847331 Semiconductor chip including region having cross-coupled transistor configuration with offset electrical connection areas on gate electrode forming conductive structures and at least two different inner extension distances of gate electrode forming conductive structures
US Patent 10304846 Three dimensional integrated circuits employing thin film transistors
US Patent 9613887 Semiconductor system, device and structure
US Patent 10910364 3D semiconductor device
US Patent 8728893 Method of fabricating a three-dimentional semiconductor memory device
US Patent 8796085 Vertical super-thin body semiconductor on dielectric wall devices and methods of their fabrication
Patent Inventor Names
Tommy Allen Agan
James John Lupino
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11750191
Patent Primary Examiner
Vibol Tan
CPC Code
H01L 27/092
H01L 27/286
H01L 51/0558
H01L 27/283
H01L 23/528
H01L 29/7827
H01L 27/281
H01L 29/78693
H01L 51/0048
H01L 23/5226
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