Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11756853 Semiconductor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 7, 2022
Date of Patent
September 12, 2023
Patent Application Number
17715260
Patent Citations
‌
US Patent 9269694 Packages with thermal management features for reduced thermal crosstalk and methods of forming same
‌
US Patent 7250676 Multi-package module with heat spreader
‌
US Patent 7446409 Cavity-down multiple-chip package
Patent Inventor Names
Dong Joo Choi
Seung Duk Baek
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11756853
Patent Primary Examiner
‌
Thao P. Le
CPC Code
‌
H01L 27/14609
‌
H01L 27/14621
‌
H01L 27/14636
‌
H01L 27/14629

Find more entities like US Patent 11756853 Semiconductor package

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo