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US Patent 11756880 Interconnect structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 27, 2021
Date of Patent
September 12, 2023
Patent Application Number
17486633
Patent Citations
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 11367652 Microelectronic assembly from processed substrate
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US Patent 11385278 Security circuitry for bonded structures
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US Patent 11387202 Nanowire bonding interconnect for fine-pitch microelectronics
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US Patent 11387214 Multi-chip modules formed using wafer-level processing of a reconstituted wafer
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US Patent 11393779 Large metal pads over TSV
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US Patent 11462419 Microelectronic assemblies
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US Patent 11476213 Bonded structures without intervening adhesive
•••
Patent Citations Received
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US Patent 12125784 Interconnect structures
0
Patent Inventor Names
Gaius Gillman Fountain, Jr.
Jeremy Alfred Theil
Cyprian Emeka Uzoh
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11756880
Patent Primary Examiner
‌
Nitin Parekh
CPC Code
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H01L 21/2007
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H01L 23/5226
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H01L 23/3178

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