Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 19, 2022
Patent Application Number
16439622
Date Filed
June 12, 2019
Patent Citations
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Patent Citations Received
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Patent Primary Examiner
Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a metal pad having a larger diameter or surface area (e.g., oversized for the application) may be used when a contact pad is positioned over a TSV in one or both substrates.
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