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US Patent 11393779 Large metal pads over TSV

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 12, 2019
Date of Patent
July 19, 2022
Patent Application Number
16439622
Patent Citations
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US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
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US Patent 11069734 Image sensor device
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US Patent 11037919 Techniques for processing devices
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US Patent 10002844 Bonded structures
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10075657 Edgeless large area camera system
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US Patent 10103122 Hybrid bonding systems and methods for semiconductor wafers
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US Patent 10147641 3D IC method and device
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10211166 Semiconductor device and method of manufacturing the same
•••
Patent Citations Received
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US Patent 12125784 Interconnect structures
0
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US Patent 11694925 Diffusion barrier collar for interconnects
0
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US Patent 11749645 TSV as pad
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US Patent 11756880 Interconnect structures
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US Patent 11790219 Three dimensional circuit implementing machine trained network
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US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
0
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US Patent 11978724 Diffused bitline replacement in memory
0
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US Patent 12068278 Processed stacked dies
0
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
0
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US Patent 12113056 Stacked dies and methods for forming bonded structures
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11393779
Patent Primary Examiner
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Bilkis Jahan
CPC Code
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H01L 24/08
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H01L 2224/80896
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H01L 2224/08146
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H01L 21/76898
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H01L 24/05
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H01L 2224/80001
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H01L 23/481

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